IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards. IPC-2222 Sectional Design Standard for Rigid Organic Printed Boards ASSOCIATION CONNECTING ELECTRONICS INDUSTRIES 2215.

Used in conjunction with IPC-2221, IPC-2222 establishes the specific requirements for the design of rigid organic printed boards and other forms of component mounting and interconnecting structures. This standard applies to single-sided, double-sided or multi-layered boards. Key concepts in this document are: rigid laminate properties, design requirements for printed board assembly and design requirements for holes/interconnections.

Revision A provides new design guidance and requirements for dielectric spacing, lead-free laminate materials, scoring and routing parameters, printed board thickness tolerance, nonfunctional lands, hole aspect ratios and clearance areas in planes. Xerces Sample Programs. 33 pages. Released December 2010.

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All aspects and details of the design requirements are addressed to the extent that they can be applied to the unique requirements of those designs that use organic rigid (reinforced) materials or organic materials in combination with inorganic materials (metal, glass, ceramic, etc.) to provide the structure for mounting and interconnecting electronic, electromechanical, and mechanical components. Product Details Edition: A Published: Number of Pages: 44 File Size: 1 file, 2.4 MB Document History • •.